Issued Patents 2024
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12174246 | Security circuitry for bonded structures | Belgacem Haba, Guy Regev | 2024-12-24 |
| 12176303 | Wafer-level bonding of obstructive elements | Rajesh Katkar | 2024-12-24 |
| 12154858 | Connecting multiple chips using an interconnect device | Belgacem Haba | 2024-11-26 |
| 12142528 | 3D chip with shared clock distribution network | Steven Teig, Ilyas Mohammed, Eric Nequist | 2024-11-12 |
| 12113054 | Non-volatile dynamic random access memory | Pearl Po-Yee Cheng, David Edward Fisch | 2024-10-08 |
| 12100684 | Bonded structures | Liang Wang, Rajesh Katkar, Arkalgud R. Sitaram | 2024-09-24 |
| 12094835 | Wire bonding method and apparatus for electromagnetic interference shielding | Shaowu Huang | 2024-09-17 |
| 12080672 | Direct gang bonding methods including directly bonding first element to second element to form bonded structure without adhesive | Belgacem Haba, Laura Wills Mirkarimi, Rajesh Katkar, Cyprian Emeka Uzoh, Guilian Gao +1 more | 2024-09-03 |
| 12074092 | Hard IP blocks with physically bidirectional passageways | — | 2024-08-27 |
| 12057383 | Bonded structures with integrated passive component | Belgacem Haba, Ilyas Mohammed, Rajesh Katkar, Gabriel Z. Guevara, Shaowu Huang +1 more | 2024-08-06 |
| 11967575 | Bond enhancement structure in microelectronics for trapping contaminants during direct-bonding processes | Guilian Gao, Shaowu Huang, Liang Wang, Gaius Gillman Fountain, Jr., Rajesh Katkar +1 more | 2024-04-23 |
| 11929347 | Mixed exposure for large die | Belgacem Haba | 2024-03-12 |
| 11916076 | Device disaggregation for improved performance | Don Draper, Jung Ko, Steven Teig | 2024-02-27 |
| 11901281 | Bonded structures with integrated passive component | Belgacem Haba | 2024-02-13 |
| 11894345 | Integrated voltage regulator and passive components | Don Draper, Belgacem Haba, Ilyas Mohammed | 2024-02-06 |
| 11881454 | Stacked IC structure with orthogonal interconnect layers | Ilyas Mohammed, Steven Teig | 2024-01-23 |
| 11876076 | Apparatus for non-volatile random access memory stacks | Belgacem Haba, Rajesh Katkar, Pearl Po-Yee Cheng | 2024-01-16 |
| 11862602 | Scalable architecture for reduced cycles across SOC | Richard E. Perego | 2024-01-02 |
| 11862604 | Systems and methods for releveled bump planes for chiplets | Belgacem Haba, Cyprian Emeka Uzoh, Rajesh Katkar, Ilyas Mohammed | 2024-01-02 |
| 11860415 | Integrated optical waveguides, direct-bonded waveguide interface joints, optical routing and interconnects | Shaowu Huang, Liang Wang, Guilian Gao | 2024-01-02 |