Issued Patents 2024
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12136605 | Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics and method for forming the same | Gaius Gillman Fountain, Jr., Laura Wills Mirkarimi, Rajesh Katkar, Ilyas Mohammed, Cyprian Emeka Uzoh | 2024-11-05 |
| 12132020 | Low temperature bonded structures | Cyprian Emeka Uzoh, Jeremy Alfred Theil, Rajesh Katkar, Laura Wills Mirkarimi | 2024-10-29 |
| 12100676 | Low temperature bonded structures | Cyprian Emeka Uzoh, Jeremy Alfred Theil, Rajesh Katkar, Laura Wills Mirkarimi | 2024-09-24 |
| 12080672 | Direct gang bonding methods including directly bonding first element to second element to form bonded structure without adhesive | Belgacem Haba, Laura Wills Mirkarimi, Javier A. Delacruz, Rajesh Katkar, Cyprian Emeka Uzoh +1 more | 2024-09-03 |
| 12068278 | Processed stacked dies | Cyprian Emeka Uzoh, Laura Wills Mirkarimi, Gaius Gillman Fountain, Jr. | 2024-08-20 |
| 12046571 | Low temperature bonded structures | Cyprian Emeka Uzoh, Jeremy Alfred Theil, Liang Wang, Rajesh Katkar, Laura Wills Mirkarimi | 2024-07-23 |
| 12009338 | Dimension compensation control for directly bonded structures | Laura Wills Mirkarimi, Gaius Gillman Fountain, Jr., Cyprian Emeka Uzoh | 2024-06-11 |
| 11978681 | Mitigating surface damage of probe pads in preparation for direct bonding of a substrate | Laura Wills Mirkarimi, Gaius Gillman Fountain, Jr. | 2024-05-07 |
| 11967575 | Bond enhancement structure in microelectronics for trapping contaminants during direct-bonding processes | Javier A. Delacruz, Shaowu Huang, Liang Wang, Gaius Gillman Fountain, Jr., Rajesh Katkar +1 more | 2024-04-23 |
| 11955463 | Direct bonded stack structures for increased reliability and improved yield in microelectronics | Cyprian Emeka Uzoh, Rajesh Katkar, Thomas Workman, Gaius Gillman Fountain, Jr., Laura Wills Mirkarimi +3 more | 2024-04-09 |
| 11955445 | Metal pads over TSV | Bongsub Lee, Gaius Gillman Fountain, Jr., Cyprian Emeka Uzoh, Laura Wills Mirkarimi, Belgacem Haba +1 more | 2024-04-09 |
| 11860415 | Integrated optical waveguides, direct-bonded waveguide interface joints, optical routing and interconnects | Shaowu Huang, Javier A. Delacruz, Liang Wang | 2024-01-02 |