Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12080672 | Direct gang bonding methods including directly bonding first element to second element to form bonded structure without adhesive | Belgacem Haba, Laura Wills Mirkarimi, Javier A. Delacruz, Rajesh Katkar, Cyprian Emeka Uzoh +1 more | 2024-09-03 |
| 11955463 | Direct bonded stack structures for increased reliability and improved yield in microelectronics | Cyprian Emeka Uzoh, Rajesh Katkar, Guilian Gao, Gaius Gillman Fountain, Jr., Laura Wills Mirkarimi +3 more | 2024-04-09 |