Issued Patents 2024
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176264 | Manifold designs for embedded liquid cooling in a package | Belgacem Haba, Laura Wills Mirkarimi, Ron Zhang, Rajesh Katkar | 2024-12-24 |
| 12136605 | Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics and method for forming the same | Guilian Gao, Laura Wills Mirkarimi, Rajesh Katkar, Ilyas Mohammed, Cyprian Emeka Uzoh | 2024-11-05 |
| 12125784 | Interconnect structures | Cyprian Emeka Uzoh, Jeremy Alfred Theil | 2024-10-22 |
| 12068278 | Processed stacked dies | Cyprian Emeka Uzoh, Guilian Gao, Laura Wills Mirkarimi | 2024-08-20 |
| 12009338 | Dimension compensation control for directly bonded structures | Guilian Gao, Laura Wills Mirkarimi, Cyprian Emeka Uzoh | 2024-06-11 |
| 11978681 | Mitigating surface damage of probe pads in preparation for direct bonding of a substrate | Guilian Gao, Laura Wills Mirkarimi | 2024-05-07 |
| 11967575 | Bond enhancement structure in microelectronics for trapping contaminants during direct-bonding processes | Guilian Gao, Javier A. Delacruz, Shaowu Huang, Liang Wang, Rajesh Katkar +1 more | 2024-04-23 |
| 11955393 | Structures for bonding elements including conductive interface features | Rajesh Katkar, Laura Wills Mirkarimi, Bongsub Lee, Cyprian Emeka Uzoh | 2024-04-09 |
| 11955463 | Direct bonded stack structures for increased reliability and improved yield in microelectronics | Cyprian Emeka Uzoh, Rajesh Katkar, Thomas Workman, Guilian Gao, Laura Wills Mirkarimi +3 more | 2024-04-09 |
| 11955445 | Metal pads over TSV | Guilian Gao, Bongsub Lee, Cyprian Emeka Uzoh, Laura Wills Mirkarimi, Belgacem Haba +1 more | 2024-04-09 |