Issued Patents 2024
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12094835 | Wire bonding method and apparatus for electromagnetic interference shielding | Javier A. Delacruz | 2024-09-17 |
| 12088090 | Electrostatic discharge protection apparatus and method for data transceiver | Dance Wu | 2024-09-10 |
| 12057383 | Bonded structures with integrated passive component | Belgacem Haba, Ilyas Mohammed, Rajesh Katkar, Gabriel Z. Guevara, Javier A. Delacruz +1 more | 2024-08-06 |
| 12028966 | Printed circuit board including on-board integrated enclosure for electromagnetic compatibility shielding | Dance Wu | 2024-07-02 |
| 11967575 | Bond enhancement structure in microelectronics for trapping contaminants during direct-bonding processes | Guilian Gao, Javier A. Delacruz, Liang Wang, Gaius Gillman Fountain, Jr., Rajesh Katkar +1 more | 2024-04-23 |
| 11903123 | Common-mode filtering for converting differential signaling to single-ended signaling | Dance Wu | 2024-02-13 |
| 11860415 | Integrated optical waveguides, direct-bonded waveguide interface joints, optical routing and interconnects | Javier A. Delacruz, Liang Wang, Guilian Gao | 2024-01-02 |