Issued Patents 2024
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12142528 | 3D chip with shared clock distribution network | Javier A. Delacruz, Steven Teig, Eric Nequist | 2024-11-12 |
| 12136605 | Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics and method for forming the same | Guilian Gao, Gaius Gillman Fountain, Jr., Laura Wills Mirkarimi, Rajesh Katkar, Cyprian Emeka Uzoh | 2024-11-05 |
| 12124035 | Stretchable film assembly with conductive traces | Belgacem Haba, Gabriel Z. Guevara, Min Tao | 2024-10-22 |
| 12057383 | Bonded structures with integrated passive component | Belgacem Haba, Rajesh Katkar, Gabriel Z. Guevara, Javier A. Delacruz, Shaowu Huang +1 more | 2024-08-06 |
| 11914148 | Stacked optical waveguides | Rajesh Katkar, Belgacem Haba | 2024-02-27 |
| 11894345 | Integrated voltage regulator and passive components | Javier A. Delacruz, Don Draper, Belgacem Haba | 2024-02-06 |
| 11881454 | Stacked IC structure with orthogonal interconnect layers | Steven Teig, Javier A. Delacruz | 2024-01-23 |
| 11862604 | Systems and methods for releveled bump planes for chiplets | Javier A. Delacruz, Belgacem Haba, Cyprian Emeka Uzoh, Rajesh Katkar | 2024-01-02 |