Issued Patents 2024
Showing 26–30 of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11892774 | Lithography | Meng-Che Tu, Po-Han Wang, Sih-Hao Liao, Hung-Jui Kuo | 2024-02-06 |
| 11894336 | Integrated fan-out package and manufacturing method thereof | Jhih-Yu Wang, Hung-Jui Kuo, Sih-Hao Liao, Yung-Chi Chu | 2024-02-06 |
| 11868047 | Polymer layer in semiconductor device and method of manufacture | Sih-Hao Liao, Hung-Jui Kuo, Chen-Hua Yu | 2024-01-09 |
| 11862594 | Package structure with solder resist underlayer for warpage control and method of manufacturing the same | Ting-Chen Tseng, Hung-Jui Kuo, Sih-Hao Liao | 2024-01-02 |
| 11862560 | Package structure and method of manufacturing the same | Yung-Chi Chu, Hung-Jui Kuo, Wei-Chih Chen | 2024-01-02 |