Issued Patents 2024
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12151932 | Microelectromechanical systems device having a mechanically robust anti-stiction/outgassing structure | Kuei-Sung Chang, Fei-Lung Lai, Shing-Chyang Pan, Yuan-Chih Hsieh, Yi-Ren Wang | 2024-11-26 |
| 12134555 | Method and structure for CMOS-MEMS thin film encapsulation | Yu-Chia Liu, Chia-Hua Chu | 2024-11-05 |
| 12054383 | MEMS microphone and MEMS accelerometer on a single substrate | Chia-Hua Chu, Chun-Yin Tsai, Wen Cheng Kuo | 2024-08-06 |
| 12043538 | Semiconductor device structure with movable membrane | Yi-Chuan Teng, Chun-Yin Tsai, Chia-Hua Chu | 2024-07-23 |
| 11987891 | Sensor in an internet-of-things | Ming-Ta Lei, Chia-Hua Chu, Hsin-Chih Chiang, Tung-Tsun Chen | 2024-05-21 |
| 11987494 | Wire-bond damper for shock absorption | Tsung-Lin Hsieh, Wei-Jhih Mao, Shang-Ying Tsai, Kuei-Sung Chang | 2024-05-21 |
| 11970387 | Micro-electro mechanical system device containing a bump stopper and methods for forming the same | Chi-Hang Chin, Kuei-Sung Chang | 2024-04-30 |