Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11987494 | Wire-bond damper for shock absorption | Wei-Jhih Mao, Shang-Ying Tsai, Kuei-Sung Chang, Chun-Wen Cheng | 2024-05-21 |
TH
Tsung-Lin Hsieh
Overall (2024): #234,279 of 561,600Top 45%
1
Patents 2024