Issued Patents 2024
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12151932 | Microelectromechanical systems device having a mechanically robust anti-stiction/outgassing structure | Chun-Wen Cheng, Fei-Lung Lai, Shing-Chyang Pan, Yuan-Chih Hsieh, Yi-Ren Wang | 2024-11-26 |
| 12002780 | Package structure including a base and a lid disposed over the base and method of forming the package structure | — | 2024-06-04 |
| 11993510 | Composite spring structure to reinforce mechanical robustness of a MEMS device | Shang-Ying Tsai, Wei-Jhih Mao | 2024-05-28 |
| 11987494 | Wire-bond damper for shock absorption | Tsung-Lin Hsieh, Wei-Jhih Mao, Shang-Ying Tsai, Chun-Wen Cheng | 2024-05-21 |
| 11970387 | Micro-electro mechanical system device containing a bump stopper and methods for forming the same | Chun-Wen Cheng, Chi-Hang Chin | 2024-04-30 |
| 11965731 | Package structure and measurement method for the package structure | — | 2024-04-23 |
| 11923331 | Die attached leveling control by metal stopper bumps | Wei-Jhih Mao, Shang-Ying Tsai | 2024-03-05 |