Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11993510 | Composite spring structure to reinforce mechanical robustness of a MEMS device | Kuei-Sung Chang, Shang-Ying Tsai | 2024-05-28 |
| 11987494 | Wire-bond damper for shock absorption | Tsung-Lin Hsieh, Shang-Ying Tsai, Kuei-Sung Chang, Chun-Wen Cheng | 2024-05-21 |
| 11923331 | Die attached leveling control by metal stopper bumps | Kuei-Sung Chang, Shang-Ying Tsai | 2024-03-05 |