Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176407 | Method of forming a transistor device with a gate structure having a pair of recess regions and a resistive protection layer within | Chen-Liang Chu, Chien-Chih Chou, Chih-Chang Cheng, Yi-Huan Chen, Kong-Beng Thei +2 more | 2024-12-24 |
| 12027526 | Breakdown voltage capability of high voltage device | Hsin-Chih Chiang, Tung-Yang Lin, Ruey-Hsin Liu | 2024-07-02 |
| 11987891 | Sensor in an internet-of-things | Chia-Hua Chu, Hsin-Chih Chiang, Tung-Tsun Chen, Chun-Wen Cheng | 2024-05-21 |
| 11978810 | Method for forming an IC including a varactor with reduced surface field region | Liang-Yu Su, Chih-Wen Yao, Hsiao-Chin Tuan | 2024-05-07 |
| 11923429 | Plate design to decrease noise in semiconductor devices | Chih-Chang Cheng, Fu-Yu Chu, Ruey-Hsin Liu, Shih-Fen Huang | 2024-03-05 |
| 11916115 | Field plate structure to enhance transistor breakdown voltage | Chia-Cheng Ho, Yu-Chang Jong | 2024-02-27 |