Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12100757 | Cap structure coupled to source to reduce saturation current in HEMT device | Ming-Cheng Lin, Chen-Bau Wu, Chun Lin Tsai, Haw-Yun Wu, Yun-Hsiang Wang | 2024-09-24 |
| 11978810 | Method for forming an IC including a varactor with reduced surface field region | Chih-Wen Yao, Hsiao-Chin Tuan, Ming-Ta Lei | 2024-05-07 |
| 11973076 | Electrostatic discharge protection circuit and semiconductor circuit | Ming-Fang Lai, Hang Fan | 2024-04-30 |