Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12100757 | Cap structure coupled to source to reduce saturation current in HEMT device | Chen-Bau Wu, Chun Lin Tsai, Haw-Yun Wu, Liang-Yu Su, Yun-Hsiang Wang | 2024-09-24 |
| 12087820 | Semiconductor device having a plurality of III-V semiconductor layers | Yu-Syuan Lin, Jiun-Lei Jerry Yu, Chun Lin Tsai | 2024-09-10 |
| 11901261 | Reusable holding component for heatsink | — | 2024-02-13 |
| 11903157 | Reusable holding component for heatsink | — | 2024-02-13 |