Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12100757 | Cap structure coupled to source to reduce saturation current in HEMT device | Ming-Cheng Lin, Chen-Bau Wu, Chun Lin Tsai, Haw-Yun Wu, Liang-Yu Su | 2024-09-24 |
| 12094838 | Crack stop ring trench to prevent epitaxy crack propagation | Jiun-Yu Chen, Chun Lin Tsai, Chia-Hsun Wu, Jiun-Lei Jerry Yu, Po-Chih Chen | 2024-09-17 |
| 12046537 | Front-end-of-line (FEOL) through semiconductor-on-substrate via (TSV) | Chun Lin Tsai, Jiun-Lei Jerry Yu, Po-Chih Chen | 2024-07-23 |