Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12107156 | Semiconductor structure, HEMT structure and method of forming the same | Yao-Chung Chang, Jiun-Lei Jerry Yu, Chun Lin Tsai | 2024-10-01 |
| 12094838 | Crack stop ring trench to prevent epitaxy crack propagation | Jiun-Yu Chen, Chun Lin Tsai, Yun-Hsiang Wang, Chia-Hsun Wu, Jiun-Lei Jerry Yu | 2024-09-17 |
| 12046537 | Front-end-of-line (FEOL) through semiconductor-on-substrate via (TSV) | Yun-Hsiang Wang, Chun Lin Tsai, Jiun-Lei Jerry Yu | 2024-07-23 |
| 11862675 | High voltage metal-oxide-semiconductor (HVMOS) device integrated with a high voltage junction termination (HVJT) device | Karthick Murukesan, Wen-Chih Chiang, Chun Lin Tsai, Ker Hsiao Huo, Kuo-Ming Wu +5 more | 2024-01-02 |