Issued Patents 2024
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176203 | Methods and apparatuses for forming semiconductor devices containing tungsten layers using a tungsten growth suppressant | Fei Zhou, Rahul Sharangpani, Raghuveer S. Makala, Yujin Terasawa, Naoki Takeguchi +1 more | 2024-12-24 |
| 12148478 | Erase method for non-volatile memory with multiple tiers | Xiang Yang, Abhijith Prakash, Dengtao Zhao | 2024-11-19 |
| 12135542 | Modelling and prediction of virtual inline quality control in the production of memory devices | Tsuyoshi Sendoda, Yusuke Ikawa, Nagarjuna Asam, Kei Samura | 2024-11-05 |
| 12127410 | Memory device including a ferroelectric semiconductor channel and methods of forming the same | Peter Rabkin | 2024-10-22 |
| 12125814 | Bonded assembly containing different size opposing bonding pads and methods of forming the same | Lin Hou, Peter Rabkin | 2024-10-22 |
| 12105137 | Virtual quality control interpolation and process feedback in the production of memory devices | Yusuke Ikawa, Tsuyoshi Sendoda, Kei Samura | 2024-10-01 |
| 12016179 | Three dimensional memory device containing resonant tunneling barrier and high mobility channel and method of making thereof | Peter Rabkin | 2024-06-18 |
| 12009269 | Virtual metrology for feature profile prediction in the production of memory devices | Cheng-Chung Chu, Yusuke Ikawa, Seyyed Ehsan Esfahani RASHIDI, Kei Samura, Tsuyoshi Sendoda +1 more | 2024-06-11 |
| 12004348 | Three-dimensional memory array with dual-level peripheral circuits and methods for forming the same | Yuki Mizutani, Fumiaki Toyama | 2024-06-04 |
| 11996153 | Three-dimensional memory device with separated contact regions and methods for forming the same | James Kai, Yuki Mizutani, Hisakazu Otoi, Hiroyuki Ogawa | 2024-05-28 |
| 11963352 | Three-dimensional memory device with vertical field effect transistors and method of making thereof | Peter Rabkin | 2024-04-16 |
| 11948902 | Bonded assembly including an airgap containing bonding-level dielectric layer and methods of forming the same | Lin Hou, Peter Rabkin, Adarsh Rajashekhar, Raghuveer S. Makala | 2024-04-02 |
| 11901019 | Use of data latches for compression of soft bit data in non-volatile memories | Hua-Ling Cynthia Hsu, YenLung Li, Chen Chen | 2024-02-13 |
| 11869877 | Bonded assembly including inter-die via structures and methods for making the same | Lin Hou, Peter Rabkin, Yangyin Chen | 2024-01-09 |
| 11871580 | Three-dimensional memory device including low-k drain-select-level isolation structures and methods of forming the same | Peng Zhang, Yanli Zhang, Xiang Yang, Koichi Matsuno, Johann Alsmeier | 2024-01-09 |