Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12125814 | Bonded assembly containing different size opposing bonding pads and methods of forming the same | Peter Rabkin, Masaaki Higashitani | 2024-10-22 |
| 12026503 | Device of updating library required by testing program for testing and method thereof | — | 2024-07-02 |
| 11948902 | Bonded assembly including an airgap containing bonding-level dielectric layer and methods of forming the same | Peter Rabkin, Adarsh Rajashekhar, Raghuveer S. Makala, Masaaki Higashitani | 2024-04-02 |
| 11869877 | Bonded assembly including inter-die via structures and methods for making the same | Peter Rabkin, Yangyin Chen, Masaaki Higashitani | 2024-01-09 |