Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11869877 | Bonded assembly including inter-die via structures and methods for making the same | Lin Hou, Peter Rabkin, Masaaki Higashitani | 2024-01-09 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11869877 | Bonded assembly including inter-die via structures and methods for making the same | Lin Hou, Peter Rabkin, Masaaki Higashitani | 2024-01-09 |