Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12125814 | Bonded assembly containing different size opposing bonding pads and methods of forming the same | Lin Hou, Masaaki Higashitani | 2024-10-22 |
| 12127410 | Memory device including a ferroelectric semiconductor channel and methods of forming the same | Masaaki Higashitani | 2024-10-22 |
| 12016179 | Three dimensional memory device containing resonant tunneling barrier and high mobility channel and method of making thereof | Masaaki Higashitani | 2024-06-18 |
| 11963352 | Three-dimensional memory device with vertical field effect transistors and method of making thereof | Masaaki Higashitani | 2024-04-16 |
| 11948902 | Bonded assembly including an airgap containing bonding-level dielectric layer and methods of forming the same | Lin Hou, Adarsh Rajashekhar, Raghuveer S. Makala, Masaaki Higashitani | 2024-04-02 |
| 11869877 | Bonded assembly including inter-die via structures and methods for making the same | Lin Hou, Yangyin Chen, Masaaki Higashitani | 2024-01-09 |