Issued Patents 2024
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176203 | Methods and apparatuses for forming semiconductor devices containing tungsten layers using a tungsten growth suppressant | Fei Zhou, Raghuveer S. Makala, Yujin Terasawa, Naoki Takeguchi, Kensuke Yamaguchi +1 more | 2024-12-24 |
| 12137565 | Three-dimensional memory device with vertical word line barrier and methods for forming the same | Raghuveer S. Makala, Fei Zhou, Adarsh Rajashekhar | 2024-11-05 |
| 12096636 | Semiconductor device containing bit lines separated by air gaps and methods for forming the same | Adarsh Rajashekhar, Raghuveer S. Makala, Fei Zhou | 2024-09-17 |
| 12087628 | High aspect ratio via fill process employing selective metal deposition and structures formed by the same | Raghuveer S. Makala, Fumitaka Amano | 2024-09-10 |
| 12035535 | Three-dimensional NOR array including vertical word lines and discrete memory elements and methods of manufacture | Adarsh Rajashekhar, Raghuveer S. Makala | 2024-07-09 |
| 12010841 | Method of making a three-dimensional memory device using composite hard masks for formation of deep via openings | Monica Titus, Senaka Kanakamedala, Raghuveer S. Makala, Yao-Sheng Lee | 2024-06-11 |
| 11984395 | Semiconductor device containing bit lines separated by air gaps and methods for forming the same | Adarsh Rajashekhar, Raghuveer S. Makala, Fei Zhou | 2024-05-14 |
| 11972954 | Method of making a three-dimensional memory device using composite hard masks for formation of deep via openings | Roshan Jayakhar TIRUKKONDA, Senaka Kanakamedala, Raghuveer S. Makala, Monica Titus | 2024-04-30 |
| 11968826 | Three-dimensional memory device with metal-barrier-metal word lines and methods of making the same | Ramy Nashed Bassely Said, Raghuveer S. Makala, Senaka Kanakamedala | 2024-04-23 |
| 11877446 | Three-dimensional memory device with electrically conductive layers containing vertical tubular liners and methods for forming the same | Raghuveer S. Makala, Fei Zhou, Adarsh Rajashekhar | 2024-01-16 |