Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12087626 | High aspect ratio via fill process employing selective metal deposition and structures formed by the same | Kensuke Ishikawa | 2024-09-10 |
| 12087628 | High aspect ratio via fill process employing selective metal deposition and structures formed by the same | Rahul Sharangpani, Raghuveer S. Makala | 2024-09-10 |
| 11990413 | Three-dimensional memory device including aluminum alloy word lines and method of making the same | Linghan Chen, Raghuveer S. Makala | 2024-05-21 |
| 11935784 | Three-dimensional memory device containing self-aligned bit line contacts and methods for forming the same | Yusuke OSAWA, Kensuke Ishikawa, Mitsuteru Mushiga, Motoki KAWASAKI, Shinsuke Yada +4 more | 2024-03-19 |