Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12087626 | High aspect ratio via fill process employing selective metal deposition and structures formed by the same | Fumitaka Amano | 2024-09-10 |
| 11935784 | Three-dimensional memory device containing self-aligned bit line contacts and methods for forming the same | Fumitaka Amano, Yusuke OSAWA, Mitsuteru Mushiga, Motoki KAWASAKI, Shinsuke Yada +4 more | 2024-03-19 |