Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12136577 | Integrated circuit die packages including a contiguous heat spreader | Feras Eid, Joe Walczyk | 2024-11-05 |
| 12080620 | Additively manufactured structures for heat dissipation from integrated circuit devices | Feras Eid, Xavier Francois Brun, Joe Walczyk, Sergio Antonio Chan Arguedas | 2024-09-03 |
| 12057370 | Vacuum modulated two phase cooling loop efficiency and parallelism enhancement | Pooya Tadayon, David Shia | 2024-08-06 |
| 12021016 | Thermally enhanced silicon back end layers for improved thermal performance | Chandra Mohan Jha, Pooya Tadayon, Aastha Uppal, Weihua Tang, Xavier Francois Brun | 2024-06-25 |
| 12000487 | System and apparatus having a seal member for sealing of a device under test | Craig Yost, Christopher Wade Ackerman | 2024-06-04 |
| 11976671 | Vacuum modulated two phase cooling loop performance enhancement | Pooya Tadayon, David Shia | 2024-05-07 |