Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12091484 | Copolymer compatibilizers and uses thereof | John Matson, Kevin J. Edgar, Junyi Chen | 2024-09-17 |
| 12057369 | Enhanced base die heat path using through-silicon vias | Weston BERTRAND, Shankar Devasenathipathy, Aaron McCann, Nicholas Neal, Zhimin Wan | 2024-08-06 |
| 12046536 | Integrated heat spreader with enhanced vapor chamber for multichip packages | Je-Young Chang, James C. Matayabas, Jr., Zhimin Wan | 2024-07-23 |
| 11923268 | Printed heat spreader structures and methods of providing same | Jesus Gerardo Reyes Schuldes, Shankar Devasenathipathy, Pramod Malatkar, Aravindha R. Antoniswamy | 2024-03-05 |
| 11881438 | First-level integration of second-level thermal interface material for integrated circuit assemblies | Elah Bozorg-Grayeli, Sergio Antonio Chan Arguedas, Aravindha R. Antoniswamy | 2024-01-23 |
| 11869824 | Thermal interface structures for integrated circuit packages | Aaron McCann, Kelly Lofgreen, Elah Bozorg-Grayeli, Aravindha R. Antoniswamy, Joseph B. Petrini | 2024-01-09 |