Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12154715 | Methods to selectively embed magnetic materials in substrate and corresponding structures | Kyu Oh Lee, Junnan Zhao, Rahul Jain, Ji-Yong Park, Sai Vadlamani +1 more | 2024-11-26 |
| 12087746 | Microelectronic assemblies having an integrated capacitor | Chong Zhang, Junnan Zhao, Ying Wang, Meizi Jiao | 2024-09-10 |
| 12026106 | Dynamic compression for multiprocessor platforms and interconnects | Keqiang Wu, Zhidong Yu, Samuel Ortiz, Weiting Chen | 2024-07-02 |
| 11901115 | Substrate assembly with encapsulated magnetic feature | Kyu Oh Lee, Rahul Jain, Sai Vadlamani, Ji-Yong Park, Junnan Zhao +1 more | 2024-02-13 |
| 11894282 | Vented lids for integrated circuit packages | Zhimin Wan, Sergio Antonio Chan Arguedas, Peng Li, Chandra Mohan Jha, Aravindha R. Antoniswamy +2 more | 2024-02-06 |