WL

Wei-Sheng Lei

Applied Materials: 4 patents #204 of 1,809Top 15%
Overall (2024): #40,433 of 561,600Top 8%
4
Patents 2024

Issued Patents 2024

Patent #TitleCo-InventorsDate
12131952 Wafer dicing using femtosecond-based laser and plasma etch Brad Eaton, Madhava Rao Yalamanchili, Saravjeet Singh, Ajay Kumar, James M. Holden 2024-10-29
12112890 Top magnets for decreased non-uniformity in PVD Borui Xia, Anthony Chih-Tung Chan, Shiyu YUE, Aravind Kamath, Mukund Sundararajan +2 more 2024-10-08
12091349 Laser dicing glass wafers using advanced laser sources Mahendran Chidambaram, Kangkang Wang, Ludovic Godet, Visweswaren Sivaramakrishnan 2024-09-17
11964343 Laser dicing system for filamenting and singulating optical devices Mahendran Chidambaram, Shmuel Erez, John Rusconi 2024-04-23