Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12131952 | Wafer dicing using femtosecond-based laser and plasma etch | Wei-Sheng Lei, Madhava Rao Yalamanchili, Saravjeet Singh, Ajay Kumar, James M. Holden | 2024-10-29 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12131952 | Wafer dicing using femtosecond-based laser and plasma etch | Wei-Sheng Lei, Madhava Rao Yalamanchili, Saravjeet Singh, Ajay Kumar, James M. Holden | 2024-10-29 |