Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12131952 | Wafer dicing using femtosecond-based laser and plasma etch | Wei-Sheng Lei, Brad Eaton, Saravjeet Singh, Ajay Kumar, James M. Holden | 2024-10-29 |
| 11915932 | Plasma etching of mask materials | Toi Yue Becky Leung, Madhavi R. Chandrachood | 2024-02-27 |