Issued Patents 2024
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12148585 | Vacuum interrupter conductor assembly with integrated Thomson coil | Santhosh Kumar Chamarajanagar Govinda Nayaka, Robert Michael Slepian, Xin Zhou, Jayaraman Muniyappan | 2024-11-19 |
| 12106958 | Method of using dual frequency RF power in a process chamber | Anup K. Singh, Rick Kustra, Vinayak Vishwanath Hassan, Bhaskar Kumar, Krishna Nittala +2 more | 2024-10-01 |
| 12094689 | Switchable delivery for semiconductor processing system | Sai Susmita Addepalli, Yue Chen, Abhigyan Keshri, Qiang Ma, Zhijun Jiang +2 more | 2024-09-17 |
| 12031416 | Flow control module for sand control management | Maria Tafur, Amrendra Kumar, Raghuram C. Kamath, Benoit Deville, Michael Dean Langlais | 2024-07-09 |
| 12020911 | Chucking process and system for substrate processing chambers | Bhaskar Kumar, Vivek Shah, Jiheng Zhao | 2024-06-25 |
| 12002702 | Wafer de-chucking detection and arcing prevention | Byung Chul Yoon, Hemant P. Mungekar | 2024-06-04 |
| 11898249 | PECVD process | Nagarajan Rajagopalan, Xinhai Han, Michael Wenyoung Tsiang, Masaki Ogata, Zhijun Jiang +17 more | 2024-02-13 |
| 11894228 | Treatments for controlling deposition defects | Sudha Rathi, Nagarajan Rajagopalan, Abdul Aziz Khaja, Prashanthi Para, Hiral D. Tailor | 2024-02-06 |
| 11875969 | Process chamber with reduced plasma arc | Fei Wu, Abdul Aziz Khaja, Sungwon Ha, Vinay Prabhakar | 2024-01-16 |
| 11859275 | Techniques to improve adhesion and defects for tungsten carbide film | Vivek Shah, Anup K. Singh, Bhaskar Kumar | 2024-01-02 |
| 11862419 | Toroidal encapsulation for high voltage vacuum interrupters | Eric Dennis Smith, Louis G. Campbell, Wangpei Li, Xin Zhou | 2024-01-02 |