Issued Patents 2023
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854786 | Deep lines and shallow lines in signal conducting paths | Te-Hsin Chiu, Shih-Wei Peng, Wei-Cheng Lin, Jiann-Tyng Tzeng, Chia-Tien Wu | 2023-12-26 |
| 11797746 | Method of forming semiconductor device having more similar cell densities in alternating rows | Wei-Cheng Lin, Hui-Ting Yang, Jiann-Tyng Tzeng, Lipen Yuan | 2023-10-24 |
| 11769723 | Three dimensional integrated circuit with monolithic inter-tier vias (MIV) | Shih-Wei Peng, Jiann-Tyng Tzeng, Kam-Tou Sio, Wei-Cheng Lin | 2023-09-26 |
| 11756876 | Semiconductor devices having power rails and signal tracks arranged in different layer | Wei-Cheng Lin, Jiann-Tyng Tzeng | 2023-09-12 |
| 11737254 | Memory device and layout, manufacturing method of the same | Te-Hsin Chiu, Jiann-Tyng Tzeng, Shih-Wei Peng | 2023-08-22 |
| 11721576 | Semiconductor devices and methods of manufacturing thereof | Te-Hsin Chiu, Shih-Wei Peng, Jiann-Tyng Tzeng | 2023-08-08 |
| 11658119 | Backside signal interconnection | Yu-Xuan Huang, Ching-Wei Tsai, Yi-Hsun Chiu, Yi-Bo Liao, Kuan-Lun Cheng +6 more | 2023-05-23 |
| 11569166 | Semiconductor device and manufacturing method thereof | Te-Hsin Chiu, Meng-Hung Shen, Wei-Cheng Lin, Jiann-Tyng Tzeng, Kam-Tou Sio | 2023-01-31 |