Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11844286 | Flat bottom electrode via (BEVA) top surface for memory | Hsia-Wei Chen, Chih-Yang Chang, Chin-Chieh Yang, Sheng-Hung Shih, Tung-Sheng Hsiao +3 more | 2023-12-12 |
| 11751485 | Flat bottom electrode via (BEVA) top surface for memory | Hsia-Wei Chen, Chih-Yang Chang, Chin-Chieh Yang, Sheng-Hung Shih, Tung-Sheng Hsiao +3 more | 2023-09-05 |
| 11678592 | Step height mitigation in resistive random access memory structures | Wei-Ming Wang, Chia-Wei Liu, Wen-Ting Chu, Yu-Wen Liao, Huei-Tzu Wang | 2023-06-13 |