Issued Patents 2023
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848291 | Cavity resonator for enhancing radio-frequency performance and methods for forming the same | Jheng-Hong Jiang, Shing-Huang Wu | 2023-12-19 |
| 11778917 | Semiconductor device and method for fabricating the same | Jia Fang, Chun-Hsien Lin | 2023-10-03 |
| 11772962 | MEMS package and forming method thereof | Chung-Nang Chen, Shing-Huang Wu | 2023-10-03 |
| 11728272 | Plasma-damage-resistant interconnect structure and methods for manufacturing the same | Jheng-Hong Jiang, Shing-Huang Wu | 2023-08-15 |
| 11710632 | Method of manufacturing at least one semiconductor device on or in a base semiconductor material disposed in a containment structure including a buried layer | Hung-Te Lin, Hung-Chih Yu | 2023-07-25 |
| 11705340 | Pit-less chemical mechanical planarization process and device structures made therefrom | Jheng-Hong Jiang, Shing-Huang Wu | 2023-07-18 |
| 11678592 | Step height mitigation in resistive random access memory structures | Wei-Ming Wang, Jen-Sheng Yang, Wen-Ting Chu, Yu-Wen Liao, Huei-Tzu Wang | 2023-06-13 |
| 11640949 | Bonded semiconductor structure utilizing concave/convex profile design for bonding pads | Chung-Sung Chiang, Yu-Ruei Chen, Yu-Hsiang Lin | 2023-05-02 |
| 11621731 | Client wireless device that merges functions of upper and lower MAC layers to support WLAN modules operating simultaneously in different wireless bands | Joseph Amalan Arul Emmanuel, Peiman Amini | 2023-04-04 |
| 11587824 | Method for manufacturing semiconductor structure | Yu-Hsiang Tsai, Chung-Chuan Tseng, Li-Hsin Chu | 2023-02-21 |