Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11772962 | MEMS package and forming method thereof | Shing-Huang Wu, Chia-Wei Liu | 2023-10-03 |
CC
Chung-Nang Chen
Overall (2023): #493,228 of 537,848Top 95%
1
Patents 2023