Issued Patents 2023
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855066 | Semiconductor structure and manufacturing method thereof | Hsiang-Tai Lu, Shuo-Mao Chen, Mill-Jer Wang, Feng-Cheng Hsu, Chao-Hsiang Yang +4 more | 2023-12-26 |
| 11854913 | Method for detecting defects in semiconductor device | Yang-Che Chen, Wei-Yu Chou, Hong-Seng Shue, Huang-Wen Tseng, Victor Chiang Liang +1 more | 2023-12-26 |
| 11837526 | Semiconductor package structure and method for manufacturing the same | Yang-Che Chen, Huang-Wen Tseng, Victor Chiang Liang, Chwen-Ming Liu | 2023-12-05 |
| 11804433 | Semiconductor package structure and method for forming the same | Yang-Che Chen, Victor Chiang Liang, Huang-Wen Tseng, Chwen-Ming Liu | 2023-10-31 |
| 11776919 | Semiconductor package | Yang-Che Chen, Victor Chiang Liang, Chwen-Ming Liu, Huang-Wen Tseng | 2023-10-03 |
| 11769698 | Method of testing semiconductor package | Chi-Hui Lai, Yang-Che Chen, Victor Chiang Liang, Chwen-Ming Liu | 2023-09-26 |
| 11721597 | Semiconductor device and manufacturing method of the same | Yang-Che Chen, Victor Chiang Liang, Huang-Wen Tseng, Chwen-Ming Liu | 2023-08-08 |
| 11626343 | Semiconductor device with enhanced thermal dissipation and method for making the same | Yang-Che Chen, Huang-Wen Tseng, Victor Chiang Liang, Chwen-Ming Liu | 2023-04-11 |