Issued Patents 2023
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854913 | Method for detecting defects in semiconductor device | Wei-Yu Chou, Hong-Seng Shue, Chen-Hua Lin, Huang-Wen Tseng, Victor Chiang Liang +1 more | 2023-12-26 |
| 11837526 | Semiconductor package structure and method for manufacturing the same | Chen-Hua Lin, Huang-Wen Tseng, Victor Chiang Liang, Chwen-Ming Liu | 2023-12-05 |
| 11804433 | Semiconductor package structure and method for forming the same | Chen-Hua Lin, Victor Chiang Liang, Huang-Wen Tseng, Chwen-Ming Liu | 2023-10-31 |
| 11776919 | Semiconductor package | Victor Chiang Liang, Chen-Hua Lin, Chwen-Ming Liu, Huang-Wen Tseng | 2023-10-03 |
| 11769698 | Method of testing semiconductor package | Chi-Hui Lai, Chen-Hua Lin, Victor Chiang Liang, Chwen-Ming Liu | 2023-09-26 |
| 11721597 | Semiconductor device and manufacturing method of the same | Chen-Hua Lin, Victor Chiang Liang, Huang-Wen Tseng, Chwen-Ming Liu | 2023-08-08 |
| 11626343 | Semiconductor device with enhanced thermal dissipation and method for making the same | Chen-Hua Lin, Huang-Wen Tseng, Victor Chiang Liang, Chwen-Ming Liu | 2023-04-11 |