Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11809000 | Photonic integrated circuit and package structure | Tsung-Yuan Yu, Hung-Yi Kuo, Cheng-Chieh Hsieh, Hao-Yi Tsai, Chung-Ming Weng +1 more | 2023-11-07 |
| 11754780 | Semiconductor package and manufacturing method thereof | Chung-Ming Weng, Hua-Kuei Lin, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai +5 more | 2023-09-12 |
| 11686908 | Photonic semiconductor device and method of manufacture | Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh +3 more | 2023-06-27 |