Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11640952 | Electronic component embedded substrate | Mi Sun Hwang, Dae Jung Byun, Chang Hwa Park, Sang Ho Jeong, Jun Hyeong Jang +4 more | 2023-05-02 |
YC
Yoo Rim Cha
Overall (2023): #195,449 of 537,848Top 40%
1
Patents 2023