Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11640952 | Electronic component embedded substrate | Mi Sun Hwang, Dae Jung Byun, Sang Ho Jeong, Jun Hyeong Jang, Ki Ho Na +4 more | 2023-05-02 |
| 11631643 | Substrate embedded electronic component package | Dae Jung Byun, Sang Ho Jeong, Je Sang Park, Mi Sun Hwang, Yong-duk Lee +2 more | 2023-04-18 |
| 11587878 | Substrate having electronic component embedded therein | Dae Jung Byun, Sang Ho Jeong, Ki Ho Na, Je Sang Park, Yong-duk Lee +1 more | 2023-02-21 |
| 11574775 | Dielectric powder and multilayer capacitor using the same | Jin Woo Kim, Min Gi Sin, Byung Hyun Park, Chin Mo Kim | 2023-02-07 |