Issued Patents 2023
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11758650 | Flexible printed circuit board and electronic device including the same | Jung Soo Kim, Sang Hyun Sim, Chang Min Ha, Jin Won Lee | 2023-09-12 |
| 11744012 | Printed circuit board and substrate including electronic component embedded therein | Mi Sun Hwang, Jung Soo Kim, Jin Won Lee, Duck Young Maeng | 2023-08-29 |
| 11640952 | Electronic component embedded substrate | Mi Sun Hwang, Chang Hwa Park, Sang Ho Jeong, Jun Hyeong Jang, Ki Ho Na +4 more | 2023-05-02 |
| 11631643 | Substrate embedded electronic component package | Chang Hwa Park, Sang Ho Jeong, Je Sang Park, Mi Sun Hwang, Yong-duk Lee +2 more | 2023-04-18 |
| 11587878 | Substrate having electronic component embedded therein | Chang Hwa Park, Sang Ho Jeong, Ki Ho Na, Je Sang Park, Yong-duk Lee +1 more | 2023-02-21 |
| 11576254 | Cable substrate | Jung Soo Kim, Sang Hyun Sim, Chang Min Ha | 2023-02-07 |