Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11763982 | Inductor and manufacturing method thereof | Sa Yong Lee | 2023-09-19 |
| 11744012 | Printed circuit board and substrate including electronic component embedded therein | Dae Jung Byun, Jung Soo Kim, Jin Won Lee, Duck Young Maeng | 2023-08-29 |
| 11640952 | Electronic component embedded substrate | Dae Jung Byun, Chang Hwa Park, Sang Ho Jeong, Jun Hyeong Jang, Ki Ho Na +4 more | 2023-05-02 |
| 11631643 | Substrate embedded electronic component package | Dae Jung Byun, Chang Hwa Park, Sang Ho Jeong, Je Sang Park, Yong-duk Lee +2 more | 2023-04-18 |