Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11658417 | Antenna substrate | Yang Je Lee, Chang Gun Oh, Hyun Kyung Park, Je Sang Park, Yong-duk Lee | 2023-05-23 |
| 11640952 | Electronic component embedded substrate | Mi Sun Hwang, Dae Jung Byun, Chang Hwa Park, Jun Hyeong Jang, Ki Ho Na +4 more | 2023-05-02 |
| 11631643 | Substrate embedded electronic component package | Dae Jung Byun, Chang Hwa Park, Je Sang Park, Mi Sun Hwang, Yong-duk Lee +2 more | 2023-04-18 |
| 11627659 | Printed circuit board and electronic package comprising the same | Je Sang Park, Yong-duk Lee | 2023-04-11 |
| 11587878 | Substrate having electronic component embedded therein | Dae Jung Byun, Chang Hwa Park, Ki Ho Na, Je Sang Park, Yong-duk Lee +1 more | 2023-02-21 |