Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11640952 | Electronic component embedded substrate | Mi Sun Hwang, Dae Jung Byun, Chang Hwa Park, Sang Ho Jeong, Ki Ho Na +4 more | 2023-05-02 |
JJ
Jun Hyeong Jang
Overall (2023): #379,608 of 537,848Top 75%
1
Patents 2023