Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11640952 | Electronic component embedded substrate | Mi Sun Hwang, Dae Jung Byun, Chang Hwa Park, Sang Ho Jeong, Jun Hyeong Jang +4 more | 2023-05-02 |
| 11631643 | Substrate embedded electronic component package | Dae Jung Byun, Chang Hwa Park, Sang Ho Jeong, Je Sang Park, Mi Sun Hwang +2 more | 2023-04-18 |