Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11637040 | Systems and methods for mitigating crack propagation in semiconductor die manufacturing | Wei Yeeng Ng, Frank Speetjens, Andrew Li, Sukhdeep Kaur, Sangeetha P. Komanduri | 2023-04-25 |
| 11594495 | Microelectronic devices including conductive levels having varying compositions, and related memory devices, electronic systems, and methods | Jordan D. Greenlee, John D. Hopkins, Everett A. McTeer, Yiping Wang, Rita J. Klein +1 more | 2023-02-28 |