Issued Patents 2023
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11844220 | Integrated assemblies and methods of forming integrated assemblies | Yiping Wang, Andrew Li, Haoyu Li, Matthew J. King, Yongjun Jeff Hu | 2023-12-12 |
| 11805645 | Integrated assemblies having rugged material fill, and methods of forming integrated assemblies | Nicholas R. Tapias, Andrew Li, Adam William Saxler, Kunal Shrotri, Erik Byers +3 more | 2023-10-31 |
| 11700729 | Memory arrays and methods used in forming a memory array comprising strings of memory cells | Yi Hu, Ramey M. Abdelrahaman, Narula Bilik, Daniel Billingsley, Zhenyu Bo +9 more | 2023-07-11 |
| 11637040 | Systems and methods for mitigating crack propagation in semiconductor die manufacturing | Rajesh Balachandran, Frank Speetjens, Andrew Li, Sukhdeep Kaur, Sangeetha P. Komanduri | 2023-04-25 |
| 11626423 | Memory arrays and methods used in forming a memory array comprising strings of memory cells | Xiaosong Zhang, Yi Hu, Tom J. John, Chandra S. Tiwari | 2023-04-11 |
| 11621273 | Integrated assemblies and methods of forming integrated assemblies | Yiping Wang, Andrew Li, Haoyu Li, Matthew J. King, Yongjun Jeff Hu | 2023-04-04 |