YW

Yiping Wang

Micron: 6 patents #231 of 1,593Top 15%
BL Blackberry Limited: 1 patents #68 of 194Top 40%
📍 Boise, ID: #74 of 687 inventorsTop 15%
🗺 Idaho: #82 of 1,268 inventorsTop 7%
Overall (2023): #11,150 of 537,848Top 3%
8
Patents 2023

Issued Patents 2023

Showing 1–8 of 8 patents

Patent #TitleCo-InventorsDate
11844220 Integrated assemblies and methods of forming integrated assemblies Andrew Li, Haoyu Li, Matthew J. King, Wei Yeeng Ng, Yongjun Jeff Hu 2023-12-12
11729964 Methods of forming an apparatus including laminate spacer structures Silvia Borsari, Stian E. Wood, Haoyu Li 2023-08-15
11721629 Memory device including staircase structure having conductive pads Alyssa N. Scarbrough, Jordan D. Greenlee, John D. Hopkins 2023-08-08
11700729 Memory arrays and methods used in forming a memory array comprising strings of memory cells Yi Hu, Ramey M. Abdelrahaman, Narula Bilik, Daniel Billingsley, Zhenyu Bo +9 more 2023-07-11
11660337 Triple live vaccine of canine distemper virus, canine parvovirus and canine infectious hepatitis virus Fengyan Li, Xiuwei Shu, Bo Wang, Wenyou Luo, Shenglei Chen +1 more 2023-05-30
11638286 System and method for supporting inter-band carrier aggregation with different UL/DL TDD configurations Jun Li, Youn Hyoung Heo 2023-04-25
11621273 Integrated assemblies and methods of forming integrated assemblies Andrew Li, Haoyu Li, Matthew J. King, Wei Yeeng Ng, Yongjun Jeff Hu 2023-04-04
11594495 Microelectronic devices including conductive levels having varying compositions, and related memory devices, electronic systems, and methods Jordan D. Greenlee, John D. Hopkins, Everett A. McTeer, Rajesh Balachandran, Rita J. Klein +1 more 2023-02-28