Issued Patents 2023
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11856764 | Memory arrays comprising strings of memory cells and methods used in forming a memory array comprising strings of memory cells | John D. Hopkins | 2023-12-26 |
| 11818968 | Conductive interconnects suitable for utilization in integrated assemblies, and methods of forming conductive interconnects | Tao Nguyen, John Mark Meldrim, Aaron K. Belsher | 2023-11-14 |
| 11812610 | Three-dimensional memory with conductive rails in conductive tiers, and related apparatus, systems, and methods | John D. Hopkins, Rita J. Klein | 2023-11-07 |
| 11805651 | Integrated assemblies and methods of forming integrated assemblies | John D. Hopkins | 2023-10-31 |
| 11792983 | Integrated circuitry comprising a memory array comprising strings of memory cells and methods used in forming a memory array comprising strings of memory cells | Daniel Billingsley, John D. Hopkins, Yongjun Jeff Hu, Swapnil Lengade | 2023-10-17 |
| 11791268 | Tungsten structures and methods of forming the structures | Christian George Emor, Travis Rampton, Everett A. McTeer, Rita J. Klein | 2023-10-17 |
| 11742282 | Conductive interconnects | Rita J. Klein, Everett A. McTeer, John D. Hopkins, Shuangqiang Luo, Song Kai Tan +3 more | 2023-08-29 |
| 11721629 | Memory device including staircase structure having conductive pads | Alyssa N. Scarbrough, Yiping Wang, John D. Hopkins | 2023-08-08 |
| 11715692 | Microelectronic devices including conductive rails, and related methods | John D. Hopkins, Francois H. Fabreguette, John Smythe | 2023-08-01 |
| 11716848 | Integrated assemblies, and methods of forming integrated assemblies | John D. Hopkins | 2023-08-01 |
| 11706918 | Memory arrays comprising strings of memory cells and methods used in forming a memory array comprising strings of memory cells | John D. Hopkins | 2023-07-18 |
| 11705500 | Assemblies having conductive structures with three or more different materials | David Ross Economy, Rita J. Klein, John Mark Meldrim, Brenda D. Kraus, Everett A. McTeer | 2023-07-18 |
| 11646206 | Methods of forming tungsten structures | David Ross Economy, Brian Beatty, John Mark Meldrim, Yongjun Jeff Hu | 2023-05-09 |
| 11600630 | Integrated assemblies and methods of forming integrated assemblies | Nancy M. Lomeli, John D. Hopkins, Jiewei Chen, Indra V. Chary, Jun Fang +5 more | 2023-03-07 |
| 11594495 | Microelectronic devices including conductive levels having varying compositions, and related memory devices, electronic systems, and methods | John D. Hopkins, Everett A. McTeer, Yiping Wang, Rajesh Balachandran, Rita J. Klein +1 more | 2023-02-28 |
| 11581330 | Memory array and method used in forming a memory array comprising strings of memory cells | John D. Hopkins, Nancy M. Lomeli, Alyssa N. Scarbrough | 2023-02-14 |
| 11574870 | Microelectronic devices including conductive structures, and related methods | John D. Hopkins, Marko Milojevic | 2023-02-07 |
| 11569120 | Memory arrays and methods used in forming a memory array comprising strings of memory cells | Daniel Billingsley, Yongjun Jeff Hu | 2023-01-31 |
| 11569258 | Integrated assemblies which include stacked memory decks, and methods of forming integrated assemblies | Liu Liu, David Daycock, Rithu K. Bhonsle, Giovanni Mazzone, Narula Bilik +2 more | 2023-01-31 |
| 11562773 | Metal-containing structures, and methods of treating metal-containing material to increase grain size and/or reduce contaminant concentration | John D. Hopkins, Peng Xu | 2023-01-24 |
| 11552090 | Integrated circuitry comprising a memory array comprising strings of memory cells and methods used in forming a memory array comprising strings of memory cells | Daniel Billingsley, John D. Hopkins, Yongjun Jeff Hu, Swapnil Lengade | 2023-01-10 |