Issued Patents 2023
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11812610 | Three-dimensional memory with conductive rails in conductive tiers, and related apparatus, systems, and methods | John D. Hopkins, Jordan D. Greenlee | 2023-11-07 |
| 11800706 | Integrated assemblies having conductive posts extending through stacks of alternating materials | Shuangqiang Luo, Indra V. Chary, Justin B. Dorhout | 2023-10-24 |
| 11791268 | Tungsten structures and methods of forming the structures | Jordan D. Greenlee, Christian George Emor, Travis Rampton, Everett A. McTeer | 2023-10-17 |
| 11742282 | Conductive interconnects | Jordan D. Greenlee, Everett A. McTeer, John D. Hopkins, Shuangqiang Luo, Song Kai Tan +3 more | 2023-08-29 |
| 11705500 | Assemblies having conductive structures with three or more different materials | David Ross Economy, Jordan D. Greenlee, John Mark Meldrim, Brenda D. Kraus, Everett A. McTeer | 2023-07-18 |
| 11600630 | Integrated assemblies and methods of forming integrated assemblies | Jordan D. Greenlee, Nancy M. Lomeli, John D. Hopkins, Jiewei Chen, Indra V. Chary +5 more | 2023-03-07 |
| 11594495 | Microelectronic devices including conductive levels having varying compositions, and related memory devices, electronic systems, and methods | Jordan D. Greenlee, John D. Hopkins, Everett A. McTeer, Yiping Wang, Rajesh Balachandran +1 more | 2023-02-28 |