JD

Justin B. Dorhout

Micron: 8 patents #167 of 1,593Top 15%
📍 Boise, ID: #67 of 687 inventorsTop 10%
🗺 Idaho: #74 of 1,268 inventorsTop 6%
Overall (2023): #10,080 of 537,848Top 2%
9
Patents 2023

Issued Patents 2023

Showing 1–9 of 9 patents

Patent #TitleCo-InventorsDate
11800706 Integrated assemblies having conductive posts extending through stacks of alternating materials Shuangqiang Luo, Indra V. Chary, Rita J. Klein 2023-10-24
11792991 Memory arrays and methods used in forming a memory array comprising strings of memory cells Paolo Tessariol, Jian Li, Ryan Meyer 2023-10-17
11744072 Integrated assemblies which include stacked memory decks John D. Hopkins, Nirup Bandaru, Damir Fazil, Nancy M. Lomeli, Jivaan Kishore Jhothiraman +1 more 2023-08-29
11705385 Memory arrays and methods used in forming a memory array and conductive through-array-vias (TAVs) Indra V. Chary, Chet E. Carter, Anilkumar Chandolu, Jun Fang, Matthew J. King +3 more 2023-07-18
11706925 Methods of forming electronic devices with channel openings or pillars extending through a tier stack John D. Hopkins, Nancy M. Lomeli, Damir Fazil 2023-07-18
11696445 Methods of forming microelectronic devices, and related memory devices, and electronic systems Shuangqiang Luo, Indra V. Chary 2023-07-04
11631684 Integrated assemblies and methods of forming integrated assemblies Kunal R. Parekh, Martin C. Roberts, Mohd Kamran Akhtar, Chet E. Carter, David Daycock 2023-04-18
11569266 Integrated structures comprising vertical channel material and having conductively-doped semiconductor material directly against lower sidewalls of the channel material Guangyu Huang, Haitao Liu, Chandra Mouli, Sanh D. Tang, Akira Goda 2023-01-31
11563022 Memory arrays and methods used in forming a memory array comprising strings of memory cells Lifang Xu, Indra V. Chary, Jian Li, Haitao Liu, Paolo Tessariol 2023-01-24